Weicon epoxy glue application kit [10551025]

WEICON epoxy glue - a two-component glue with strong bonding properties. Quickly and effectively glues materials such as metal, wood, stone, ceramics, plastics, glass, fiber-reinforced materials (GRP, CFRP, glass fiber). Perfect for service and assembly work where greater adhesive tolerance is needed. The welds made are highly resistant to impact and stretching. Also suitable for rough, uneven and poorly adhering surfaces. It can be used to fill cracks, defects and irregularities. Cold hardened, solvent-free. Technical data: Base Epoxy resin Colour grey Mixing ratio by weight 1:1 Density of the mixture 1,8 g/cm³ Viscosity of the mixture at 20°C (+68°F) 300.000 mPa·s Adhesive gap bridging up to max. 4 mm Curing temperature +6 do +40 °C Pot life at 20°C (+68°F) for 10ml material 3 -4 min. Handling strength (35% strength) after 40 min. Capable of bearing mechanical loads (50% strength) after 2 h Final strength (100%) after 24 h Pressure 10 Mpa Pull 24 Mpa Bending 58 Mpa E-Modul 4.000 - 4.500 Mpa Shore hardness D 70 Linear shrinkage 0,3 % Temperature resistance -50 do +145 °C Thermal diffusivity (23 °C) 0,286 mm²/s Thermal conductivity 0,51 W/m·K Specific heat capacity 0,904 J/(g·K) ISSA-Code 75.629.51 IMPA-Code 812981